RF-10 PCB 2-Layer 125mil High Dielectric Constant Laminates for Microstrip Patch Antennas

1.Overview of RF-10

RF-10 copper clad laminates are advanced composites made from ceramic-filled PTFE and woven fiberglass. They offer high dielectric constant and low dissipation factor, making them suitable for high-frequency applications. The thin fiberglass reinforcement enhances both rigidity and dimensional stability, which is essential for multilayer circuit manufacturing.

These laminates are designed to be a cost-effective substrate with reliable delivery times. RF-10 addresses the demand for size reduction in RF applications. It adheres well to smooth, low-profile copper, optimizing insertion losses at higher frequencies where skin effect losses become significant.

2.Key Features

Dielectric Constant: 10.2 ± 0.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
Thermal Conductivity: 0.85 W/mk (unclad)
Coefficient of Thermal Expansion (CTE):
-X: 16 ppm/°C
-Y: 20 ppm/°C
-Z: 25 ppm/°C
Moisture Absorption: 0.08%
Flammability Rating: V-0

3.Advantages

High dielectric constant for compact RF circuit design
Exceptional dimensional stability
Tight dielectric constant tolerance (10.2 ± 0.3)
Enhanced thermal management due to high thermal conductivity
Strong adhesion to smooth copper surfaces
Low expansion in X, Y, and Z directions
Competitive price-to-performance ratio

4.PCB Stackup: 2-Layer Rigid PCB

Copper Layer 1: 35 μm (1 oz)
RF-10 Core: 125 mil (3.175 mm)
Copper Layer 2: 35 μm (1 oz)

5.PCB Construction Details

6.PCB Statistics

Components: 12
Total Pads: 20
Through Hole Pads: 11
Top SMT Pads: 9
Bottom SMT Pads: 0
Vias: 16
Nets: 2

7.Type of Artwork Supplied

Gerber RS-274-X

8.Accepted Standard

IPC-Class-2

9.Availability

Worldwide

10.Typical Applications

Microstrip Patch Antennas
GPS Antennas
Passive Components (filters, couplers, power dividers)
Aircraft Collision Avoidance Systems
Satellite Components